1. Substrate hpe hkyen lajang ai lam: Substrate hku nna -madang tsaw ai FR4 PCB hpe lata la na.
2. Ntsa hpe gram lajang ai lam: Htu ai, htu ai, chemical hte htu ai, etc.
3. N-gun dat hte dip shapraw ai: PCB ntsa de n-gun dat hpe silkscreen (sh) screen printing lang nna dip shapraw u.
4. Shang bang ai: SMD hkrang hte maren, electronic arung arai ni hpe adhesive layer ntsa de bang na.
5. Curing: UV lamp lang nna, PCB ntsa kaw na n-gun rawng ai layer hte electronic arung arai ni hpe ngang ngang jum da na.
6. Ntsa de shinggrup ai lam: PCB ntsa de n-gun n rawng ai hte n-gun n rawng ai hpe makawp maga na matu, n-gun rawng ai jak hpe lang nna, anti-oxidation layer hpe bang u.
